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High tolerance to gate misalignment in low voltage gate-underlap double gate MOSFETs

机译:低压栅极叠底双栅极MOSFET对栅极失准的高容限

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摘要

.In this letter, we demonstrate for the first time that gate misalignment is not a critical limiting factor for low voltage operation in gate-underlap double gate (DG) devices. Our results show that underlap architecture significantly extends the tolerable limit of gate misalignment in 25 nm devices. DG MOSFETs with high degree of gate misalignment and optimal gate-underlap design can perform comparably or even better than self-aligned nonunderlap devices. Results show that spacer-to-straggle (s/sigma) ratio, a key design parameter for underlap devices, should be within the range of 2.3-3.0 to accommodate back gate misalignment. These results are very significant as the stringent process control requirements for achieving self-alignment in nanoscale planar DG MOSFETs are considerably relaxed
机译:在这封信中,我们首次证明栅极失准不是栅极搭接双栅极(DG)器件中低压操作的关键限制因素。我们的结果表明,重叠结构大大扩展了25 nm器件中门未对准的可容忍极限。具有高度栅极失准度和最佳栅极下重叠设计的DG MOSFET的性能与自对准非下重叠器件相当甚至更好。结果表明,隔片对散(s / sigma)的比(叠底器件的关键设计参数)应在2.3-3.0的范围内,以适应背栅失准。这些结果非常重要,因为大大放松了对实现纳米级平面DG MOSFET自对准的严格过程控制要求

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